Sihong Wang
The University of Chicago
16th International Conference on Flexible and
Printed Electronics
Program at a Glance
Plenary Speakers
Invited Speakers
Technical Program
Invited Speakers
Session 01. Next-Generation Optoelectronic Devices and Systems
Abhishek Kumar Srivastava
Hong Kong University of Science & Technology
Min-Jae Choi
Sungkyunkwan University
Young Min Song
Korea Advanced Institute of Science and Technology
Session 02. Direct Printing Materials and Process
Tianshuo Zhao
University of Hong Kong
Yong Lin Kong
Rice University
Jihyuk Yang
University of Hong Kong
Gerd Grau
York University
Session 03. Soft Bioelectronics and Biosensors
Jiaqi Liu
City University of Hong Kong
Lan Yin
Tsinghua University
Jang-Ung Park
Yonsei University
Yeongjun Lee
Korea Advanced Institute of Science and Technology
Session 04. Next-Generation Soft Robot Technologies
Dae-Young Lee
Korea Advanced Institute of Science and Technology
Mingchao Zhang
National Univ of Singapore
Shintake Jun
University of Electro-Communications
Kahye Song
Korea Institute of Science and Technology
Session 05. Next-Generation Substrate Technologies
Deyang Ji
Tianjin University
Fumitaka Ishiwari
Tokyo Metropolitan University
Jiheong Kang
Seoul National University
Hong Chul Moon
Korea Advanced Institute of Science and Technology
Session 06. 3D/4D Printing with Smart and Functional Materials
Kevin, Qi Ge
Southern University of Science and Technology
Huifeng Du
The Hong Kong Polytechnic University
Howon Lee
Seoul National University
Sangin Park
Incheon National University.
Session 07. Flexible Bio/Neuro Interfaces
Xinge Yu
The City University of Hong
Sohee Kim
Daegu Gyeongbuk Institute of Science and Technology
Krishna Jayant
Purdue University
Seung-Kyun Kang
Seoul National University
Session 08. Neuromorphic Devices and Systems
Ye Zhou
Shenzhen University
Gunuk Wang
Korea University
Wentao Xu
Nankai University
Session 09. Building Photovoltaic Materials and Systems
Sungho Hwang
Korea University
Beom-Kwan Kim
University of Ulsan
Hyeonggeun Yu
Korea Institute of Science and Technology
Jihoon Ko
KOES
Session 10. 3D/4D Printed Electronics
Shih-Chi Chen
Chinese University of Hong Kong
Mojun Chen
HKUST
Steve Park
Korea Advanced Institute of Science and Technology
Sunho Jeong
Kyung Hee University
Session 11. Organic Mixed Ionic-Electronic Materials and Devices
Simone Fabiano
Linköping University
Connor Bischak
Utah University
Joon Hak Oh
Seoul National University
Yuanyuan Hu
Hunan University
Naoji Matsuhisa
Tokyo University
Session 12. Flexible and Printed Displays
Jong Hyun Kim
Ajou University
Sunghoon Lee
RIKEN
Ho Seung Lee
Kongju National University
Young Joon Hong
Sungkyunkwan University
Session 13. Advanced Imprint Process and Devices
L. Jay Guo
University of Michigan
Hoon Eui Jeong
Ulsan National Institute of Science and Technology
Jong G. OK
Seoul National Univeristy of Science and Technology
Jiseok Lim
Yeungnam University
Sarah Swisher
University of Minnesota
Session 14. Flexible Devices & Circuits
Gyoujin Cho
Sungkyunkwan University
Gerardo Hernandez-Sosa
Karlsruhe Institute of Technology
Jiwon Lee
Pohang University of Science and Technology
Bongjun Kim
Sookmyung Women’s University
Session 15. Semiconductor Packaging
Tae-il Kim
Sungkyunkwan University
Hak-Sung Kim
Hanyang University
Joseph Andrews
University of Wisconsin-Madison
Xian Huang
Tianjin University
Session 16. Perovskite Optoelectronic Materials and Devices
Tae-Woo Lee
Seoul National University
Annamaria Petrozza
Italian Institute of Technology
Chu-Chen Chueh
National Taiwan University
Changsoon Cho
Pohang University of Science and Technology
Session 17. Roll to Roll Manufacturing
Yuta Sunami
Cross Compass Co., Ltd.
Seong-Geun Cho
Korea Research Institute of Chemical Technology
Inyoung Kim
Korea Institute of Machinery & Materials
Session 18. Organic Electronic Materials and Devices
Mario Caironi
Italian Institute of Technology
Tina Ng
UC San Diego
Wen-Ya Lee
National Taipei University of Technology
Min-Hoi Kim
Hanbat National University
Session 19. AI Technologies in Printed Electronics
Jongsu Lee
Suncheon National University
Seongju Kim
Hanbat National University
Ji-Hyeon Song
Dankook University
Session 20. Stretchable Electronics for Embodied Intelligence 1
Ying Jiang
University of Macau
Yeongin Kim
University of Cincinnati
Sun Hong Kim
University of Seoul
Gun Hee Lee
Pusan National University
Boyeon Lee
Korea Institute of Machinery & Materials(KIMM)
Session 21. Stretchable Electronics for Embodied Intelligence 2
Hiroki Ota
Yokohama University
Alwin Daus
University of Stuttgart
Jaehong Lee
Daegu Gyeongbuk Institute of Science and Technology
Hanul Moon
Dong-A University
Session 25. Young Leaders Forum
Younghoon Kim
Hanyang University
Tae Kyung Lee
Hanyang University
Session 28. Industrial Session 1
Wooyong Sung
Samsung Display
Patrick Heissler
Scrona AG
Donghwa Lee
Semes
Bukuk Oh
LG Electronics
Jonghee Kim
CHRM
Session 29. Industrial Session 2
Doyoung Byun
ENJET
Seyun Chang
MiDAS H&T, inc.
Myung Soo Huh
Samsung Display
Chaemin Lim
PARUPE
Session 30. OE-A
TBA
Editor's Talk
Soyun Joo
Wiley