ICFPE 2026
Ending Limits, Reshaping Electronics

16th International Conference on Flexible and
Printed Electronics

Program at a Glance
Technical Program
Plenary Speakers
Invited Speakers
Invited Speakers

Session 01. Next-Generation Optoelectronic devices and systems

Min-Jae Choi photo

Min-Jae Choi

Sungkyunkwan University

Young Min Song photo

Young Min Song

Korea Advanced Institute of Science and Technology(KAIST)

Sihong Wang photo

Sihong Wang

The University of Chicago

Abhishek Kumar Srivastava photo

Abhishek Kumar Srivastava

Hong Kong University of Science and Technology

Session 02. Direct Printing Materials and Process

Tianshuo Zhao photo

Tianshuo Zhao

University of Hong Kong

Yong Lin Kong photo

Yong Lin Kong

Rice University

Gerd Grau photo

Gerd Grau

York University

Jihyuk Yang photo

Jihyuk Yang

University of Hong Kong

Session 03. Soft Bioelectronics and Biosensors

Yeongjun Lee photo

Yeongjun Lee

Korea Advanced Institute of Science and Technology(KAIST)

Lan Yin photo

Lan Yin

Tsinghua University

Jang-Ung Park photo

Jang-Ung Park

Yonsei University

Jiaqi Liu photo

Jiaqi Liu

City University of Hong Kong

Session 04. Next-Generation Soft Robot Technologies

Mingchao Zhang photo

Mingchao Zhang

National Univ of Singapore

Dae-Young Lee photo

Dae-Young Lee

Korea Advanced Institute of Science and Technology(KAIST)

Shintake Jun photo

Shintake Jun

University of Electro-Communications

Kahye Song photo

Kahye Song

Korea Institute of Science and Technology(KIST)

Session 05. Next-Generation Substrate Technologies

Fumitaka Ishiwari photo

Fumitaka Ishiwari

Tokyo Metropolitan University

Jiheong Kang photo

Jiheong Kang

Seoul National University

Deyang Ji photo

Deyang Ji

Tianjin University

Hong Chul Moon photo

Hong Chul Moon

Korea Advanced Institute of Science and Technology(KAIST)

Session 06. 3D/4D Printing with Smart and Functional Materials

Kevin, Qi Ge photo

Kevin, Qi Ge

Southern University of Science and Technology (SUSTech)

Huifeng Du photo

Huifeng Du

Hong Kong Polytechnic University

Howon Lee photo

Howon Lee

Seoul National University

Sangin Park photo

Sangin Park

Incheon National University.

Session 07. Flexible Bio/Neuro Interfaces

Xinge Yu photo

Xinge Yu

The City University of Hongkong

Sohee Kim photo

Sohee Kim

Daegu Gyeongbuk Institute of Science and Technology(DGIST)

Krishna Jayant photo

Krishna Jayant

Purdue University

Seung-Kyun Kang photo

Seung-Kyun Kang

Seoul National University

Session 08. Neuromorphic Devices and Systems

Ye Zhou photo

Ye Zhou

Shenzhen University

Gunuk Wang photo

Gunuk Wang

Korea University

Wentao Xu photo

Wentao Xu

Nankai University

Tae-Wook Kim photo

Tae-Wook Kim

Jeonbuk National University

Session 09. Building Photovoltaic Materials and Systems

Sungho Hwang photo

Sungho Hwang

Korea University

Beom-Kwan Kim photo

Beom-Kwan Kim

University of Ulsan

Hyeonggeun Yu photo

Hyeonggeun Yu

Korea Institute of Science and Technology(KIST)

Gabseok Seo photo

Gabseok Seo

UNITEST

Session 10. 3D/4D Printed electronics

Shih-Chi Chen photo

Shih-Chi Chen

Chinese University of Hong Kong

Mojun Chen photo

Mojun Chen

HKUST

Hanbit Jin photo

Hanbit Jin

Electronics and Telecommunications Research Institute(ETRI)

Sunho Jeong photo

Sunho Jeong

Kyung Hee University

Session 11. Organic Mixed Ionic-Electronic Materials and Devices

Simone Fabiano photo

Simone Fabiano

Linköping University

Joon Hak Oh photo

Joon Hak Oh

Seoul National University

Yuanyuan Hu photo

Yuanyuan Hu

Hunan University

Naoji Matsuhisa photo

Naoji Matsuhisa

Tokyo University

Session 12. Flexible & Printed Displays

Ho Seung Lee photo

Ho Seung Lee

Kongju National University

Tae-Woo Lee photo

Tae-Woo Lee

Seoul National University

Sunghoon Lee photo

Sunghoon Lee

RIKEN

Young Joon Hong photo

Young Joon Hong

Sungkyunkwan University

Session 13. Advanced Imprint Process and Devices

Seok-min Kim photo

Seok-min Kim

Chung-Ang University

Sarah Swisher photo

Sarah Swisher

University of Minnesota

Hoon Eui Jeong photo

Hoon Eui Jeong

Ulsan National Institute of Science and Technology(UNIST)

Jong G. OK photo

Jong G. OK

Seoul National Univeristy of Science and Technology

Session 14. Flexible Devices & Circuits

Jiwon Lee photo

Jiwon Lee

Pohang University of Science and Technology(POSTECH)

Gyoujin Cho photo

Gyoujin Cho

Sungkyunkwan University

Gerardo Hernandez-Sosa photo

Gerardo Hernandez-Sosa

Karlsruhe Institute of Technology

Bongjun Kim photo

Bongjun Kim

Sookmyung Women’s University

Session 15. Semiconductor Packaging

Xian Huang photo

Xian Huang

Tianjin University

Joseph Andrews photo

Joseph Andrews

University of Wisconsin-Madison

Hak-Sung Kim photo

Hak-Sung Kim

Hanyang University

Tae-il Kim photo

Tae-il Kim

Sungkyunkwan University

Session 16. Perovskite Optoelectronic Materials and Devices

Jong H. Kim photo

Jong H. Kim

Ajou University

Annamaria Petrozza photo

Annamaria Petrozza

Italian Institute of Technology

Chu-Chen Chueh photo

Chu-Chen Chueh

National Taiwan University

Changsoon Cho photo

Changsoon Cho

Pohang University of Science and Technology(POSTECH)

Session 17. Roll to Roll Manufacturing

Katsunobu Suzuki photo

Katsunobu Suzuki

Cross Compass Co., Ltd.

Sun Junfeng photo

Sun Junfeng

Huazhong University of Science and Technology (HUST)

Seong-Geun Cho photo

Seong-Geun Cho

Korea Research Institute of Chemical Technology(KRICT)

Inyoung Kim photo

Inyoung Kim

Korea Institute of Machinery & Materials(KIMM)

Session 18. Organic Electronic Materials and Devices

Mario Caironi photo

Mario Caironi

Italian Institute of Technology

Tina Ng photo

Tina Ng

UC San Diego

Wen-Ya Lee photo

Wen-Ya Lee

National Taipei University of Technology(NTUT)

Min-Hoi Kim photo

Min-Hoi Kim

Hanbat National University

Session 19. AI Technologies in Printed Electronics

Jongsu Lee photo

Jongsu Lee

Suncheon National University

Ji-Hyeon Song photo

Ji-Hyeon Song

Dankook University

Kwan Hyun Cho photo

Kwan Hyun Cho

Korea Institute of Industrial Technology

Seongju Kim photo

Seongju Kim

Hanbat National University

Session 20. Stretchable Electronics for Embodied Intelligence 1

Boyeon Lee photo

Boyeon Lee

Korea Institute of Machinery & Materials(KIMM)

Sun Hong Kim photo

Sun Hong Kim

University of Seoul

Ying Jiang photo

Ying Jiang

University of Macau

Yeongin Kim photo

Yeongin Kim

University of Cincinnati

Session 21. Stretchable Electronics for Embodied Intelligence 2

Alwin Daus photo

Alwin Daus

University of Stuttgart

Hanul Moon photo

Hanul Moon

Dong-A University

Hiroki Ota photo

Hiroki Ota

Yokohama University

Jaehong Lee photo

Jaehong Lee

Daegu Gyeongbuk Institute of Science and Technology(DGIST)

Session 23. Emerging Technology 2

Tae Kyung Lee photo

Tae Kyung Lee

Hanyang University

Session 25. Young Leaders Session

Yu-Cheng Chiu photo

Yu-Cheng Chiu

National Taiwan University of Science and Technology

Liming Xie photo

Liming Xie

Suzhou Institute of Nanotech and Nanobionics, Chinese Academy of Sciences

Masahito Takakuwa photo

Masahito Takakuwa

The University of Tokyo

Feng Jiang photo

Feng Jiang

School of Materials Science and Engineering, Nanyang Technological University

Hyunjin Park photo

Hyunjin Park

Korea Research Institute of Chemical Technology

Session 28. Industrial Session 1

Wooyong Sung photo

Wooyong Sung

Samsung Display

Dong cheul Choi photo

Dong cheul Choi

AnyAble

Donghwa Lee photo

Donghwa Lee

Semes

Bukuk Oh photo

Bukuk Oh

LG Electronics

Jonghee Kim photo

Jonghee Kim

CRHM

Session 29. Industrial Session 2

Doyoung Byun photo

Doyoung Byun

ENJET

Seyun Chang photo

Seyun Chang

MiDAS H&T, inc.

Myung Soo Huh photo

Myung Soo Huh

Samsung Display

Chaemin Lim photo

Chaemin Lim

PARUPE

Session 30. OE-A

Paul Cain photo

Paul Cain

FlexEnable

Daniel Corzo photo

Daniel Corzo

Silicon Austria Labs

Zuoping Xiong photo

Zuoping Xiong

Suzhou Leanstar Electronics Technology Co., Ltd.

Fabien Resweber photo

Fabien Resweber

ALQIO (ARMOR SMART FILMS SAS)

Lina Kadura photo

Lina Kadura

CEA

Jan Birnstock photo

Jan Birnstock

Flexoo GmbH

Session 31. OE-A & ASIA

Chang-Qi Ma photo

Chang-Qi Ma

Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), CAS

SADOK BEN DKHIL photo

SADOK BEN DKHIL

DRACULA TECHNOLOGIES

Ulrich Moosheimer photo

Ulrich Moosheimer

Hochschule München

Linrun Feng photo

Linrun Feng

LinkZill

Editor's Talk

Soyun Joo photo

Soyun Joo

Wiley